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Assembly

IC and Semiconductor Devices Assembly Services

Integrated Microcircuits

ТypeLeads NumberPhoto
DIP, HDIP 8-64
SOP-SSOP-HSOP-SOIC 8-80
QFP-LQFP 32-304
QFN-DFN 4-100
BGA 56-288
Ceramic 6-408
PLCC 20-84
3D Package up to 1000
Open Cavity
QFN-QFP-SO-LCC
4-100

Discrete components

ТypeLeads NumberPhoto
Isoplus на DCB
TO-220, TO-247, TO-264
3-5
TO-220, TO-220F 2-7
TO-252, TO-263 3-7
SOT-23, SOT-223 3-6
TO-247, TO-3P
TO3PFD
3-5
SMA-SMB-SMC 2
SIP, HSIP, ZIP 8-15
Power Modules 2-6
TO Type Меtal - Glass Package 2-10
VHF Packages including Open Cavity 2-6

The Technical Specifications of the Client can be met through Development and Modification of a Package Design