Assembly

IC and Semiconductor Devices Assembly Services

Integrated Microcircuits

Тype	Leads Number	Photo
DIP, HDIP	8-64
SOP-SSOP-HSOP-SOIC	8-80
QFP-LQFP	32-304
QFN-DFN	4-100
BGA	56-288
Ceramic	6-408
PLCC	20-84
3D Package	up to 1000
Open Cavity QFN-QFP-SO-LCC	4-100

Discrete components

Тype	Leads Number	Photo
Isoplus на DCB TO-220, TO-247, TO-264	3-5
TO-220, TO-220F	2-7
TO-252, TO-263	3-7
SOT-23, SOT-223	3-6
TO-247, TO-3P TO3PFD	3-5
SMA-SMB-SMC	2
SIP, HSIP, ZIP	8-15
Power Modules	2-6
TO Type Меtal - Glass Package	2-10
VHF Packages including Open Cavity	2-6

The Technical Specifications of the Client can be met through Development and Modification of a Package Design