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Materials supply

  • Substrates and epi structures Si, GaN, SiC (4H, 6H).
  • Test Sockets for all package types (QFP, BGA, PBGA etc).
  • Trays and packaging for die, wafers, packages etc.
  • Leadframes for ICs (DIP, SO, SOIC и т.д.) and semiconductor devices (TO220, D2PAK etc.).
  • Metallized ceramics BeO, AlN, Al2O3.
  • Materials for assembly of ICs and semiconductor devices.