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  • Providing Foundry Services of foreign Wafer Foundry Fabs ( in Asia, Europe and the USA) according to door-to-door scheme for Bipolar, Trench MOSFET, IGBT, CMOS, BiCMOS, BCD, SOI Rad Hard, MEMS with technology nodes up to 0.13 µ and less.
  • Providing assembly services by foreign companies for ICs and semiconductor devices of all types of packages.
  • Shipment of import materials for electronic industry (ceramic and glass-to-metal packages, lead frames, ceramics, epitaxial structures, etc.).
  • Shipment of new and used import technological, assembly, testing, trial, metrological equipment.
  • Shipment of imported active electronic components, including chips.
  • Providing development services of ICs and semiconductor devices of Russian design-centers for foreign customers.
  • Export of competitive products of Russian manufacturers.